Stress Analysis of the Adhesively Bonded Joint Applicable to the IC Chip Pick-up Process
博士 === 國立交通大學 === 機械工程系所 === 95 === In this study, a concentrated force is applied to both adherends bonded by an adhesive under the pin-pin boundary conditions. First a mathematical model is derived with governing equations and boundary conditions. These complicated, and analytically problematic, c...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87209864299910579345 |