The Development of Heat-Generable Mold insert with Sub-micron-Structure and It’s Application to Hot-Embossing

碩士 === 國立交通大學 === 機械工程系所 === 95 === The minimization of structure and large-area molding are important trends of hot embossing. Minimization brings products more functions and large-area molding makes much economical benefit. However, normal optical lithography process makes the structure at best ac...

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Bibliographic Details
Main Authors: Chen-Chia Wu, 吳振家
Other Authors: Ren-Haw Chen
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/98313415805701116872