The Development of Heat-Generable Mold insert with Sub-micron-Structure and It’s Application to Hot-Embossing
碩士 === 國立交通大學 === 機械工程系所 === 95 === The minimization of structure and large-area molding are important trends of hot embossing. Minimization brings products more functions and large-area molding makes much economical benefit. However, normal optical lithography process makes the structure at best ac...
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ndltd-TW-095NCTU54890732015-10-13T16:13:48Z http://ndltd.ncl.edu.tw/handle/98313415805701116872 The Development of Heat-Generable Mold insert with Sub-micron-Structure and It’s Application to Hot-Embossing 具有次微米尺度結構的自發熱模仁的開發及在成形上的應用 Chen-Chia Wu 吳振家 碩士 國立交通大學 機械工程系所 95 The minimization of structure and large-area molding are important trends of hot embossing. Minimization brings products more functions and large-area molding makes much economical benefit. However, normal optical lithography process makes the structure at best achieve micron size and traditional hot embossing can only make limited area molding. In this research, we use E-beam lithography technology to make the line width of silicon-base mold insert structure reach to sub-micron size and then use plasma to etch the depth of structure. Moreover, we implant phosphorous ion into the mold insert to manufacture the circuit which can be charged an electric current to heat the mold insert. Finally, we can decrease the thermal stress, improve the integrity of the structure and make larger area molding during the demolding step by melting the material again which is beginning to solidify. Experiment results demonstrate that sub-micron structure will fracture seriously while demolding in normal hot embossing situation. Applying heat power to the mold insert by charging electric current indeed improves the integrity of the structure. Furthermore, we can improve other demolding defects like slant gradually by applying much appropriate heat power and operating period. Finally, we mold sub-micron structure successfully. Ren-Haw Chen 陳仁浩 2007 學位論文 ; thesis 71 zh-TW |
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碩士 === 國立交通大學 === 機械工程系所 === 95 === The minimization of structure and large-area molding are important trends of hot embossing. Minimization brings products more functions and large-area molding makes much economical benefit. However, normal optical lithography process makes the structure at best achieve micron size and traditional hot embossing can only make limited area molding. In this research, we use E-beam lithography technology to make the line width of silicon-base mold insert structure reach to sub-micron size and then use plasma to etch the depth of structure. Moreover, we implant phosphorous ion into the mold insert to manufacture the circuit which can be charged an electric current to heat the mold insert. Finally, we can decrease the thermal stress, improve the integrity of the structure and make larger area molding during the demolding step by melting the material again which is beginning to solidify.
Experiment results demonstrate that sub-micron structure will fracture seriously while demolding in normal hot embossing situation. Applying heat power to the mold insert by charging electric current indeed improves the integrity of the structure. Furthermore, we can improve other demolding defects like slant gradually by applying much appropriate heat power and operating period. Finally, we mold sub-micron structure successfully.
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author2 |
Ren-Haw Chen |
author_facet |
Ren-Haw Chen Chen-Chia Wu 吳振家 |
author |
Chen-Chia Wu 吳振家 |
spellingShingle |
Chen-Chia Wu 吳振家 The Development of Heat-Generable Mold insert with Sub-micron-Structure and It’s Application to Hot-Embossing |
author_sort |
Chen-Chia Wu |
title |
The Development of Heat-Generable Mold insert with Sub-micron-Structure and It’s Application to Hot-Embossing |
title_short |
The Development of Heat-Generable Mold insert with Sub-micron-Structure and It’s Application to Hot-Embossing |
title_full |
The Development of Heat-Generable Mold insert with Sub-micron-Structure and It’s Application to Hot-Embossing |
title_fullStr |
The Development of Heat-Generable Mold insert with Sub-micron-Structure and It’s Application to Hot-Embossing |
title_full_unstemmed |
The Development of Heat-Generable Mold insert with Sub-micron-Structure and It’s Application to Hot-Embossing |
title_sort |
development of heat-generable mold insert with sub-micron-structure and it’s application to hot-embossing |
publishDate |
2007 |
url |
http://ndltd.ncl.edu.tw/handle/98313415805701116872 |
work_keys_str_mv |
AT chenchiawu thedevelopmentofheatgenerablemoldinsertwithsubmicronstructureanditsapplicationtohotembossing AT wúzhènjiā thedevelopmentofheatgenerablemoldinsertwithsubmicronstructureanditsapplicationtohotembossing AT chenchiawu jùyǒucìwēimǐchǐdùjiégòudezìfārèmóréndekāifājízàichéngxíngshàngdeyīngyòng AT wúzhènjiā jùyǒucìwēimǐchǐdùjiégòudezìfārèmóréndekāifājízàichéngxíngshàngdeyīngyòng AT chenchiawu developmentofheatgenerablemoldinsertwithsubmicronstructureanditsapplicationtohotembossing AT wúzhènjiā developmentofheatgenerablemoldinsertwithsubmicronstructureanditsapplicationtohotembossing |
_version_ |
1717770237000024064 |