An Analysis on Thermal Simulation of Microwave High Power Flip-Chip Package
碩士 === 國立交通大學 === 機械工程系所 === 95 === With quick technology development, electronic products require the size minimization and multi-purpose usage. So far as the Ⅲ-Ⅴ group GaN HEMT flip chip package is concerned, the finite volume and finite element methods are applied to the thermal analysis. To impr...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/74038063954399941205 |