The Effects of Width, Via number and Analytical Method on the Mean-time-to-failure of Electromigration for Cu Interconnects
碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 95 ===
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/81869877952745387074 |