A study of the Thermosonic Flip Chip Bonding for Gold to Gold Interconnection
碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 95 === Thermo sonic flip chip technology is gold to gold interconnection(GGI); Therefore The interface possesses advantages such as better bond strength, electric characterize and reliability, simple process, leadless, non solution contamination as well ,...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/55091865016575432539 |