THE CROSS-INTERACTION OF TWO INTERFACIAL REACTIONS IN SOLDER JOINTS
博士 === 國立中央大學 === 化學工程與材料工程研究所 === 95 === The Au, Cu, Ni and Sn are the most common materials in the solder joints of electronic packages. In this thesis, the Au/Sn/Ni, Au/SnPb/Ni, Ni/Sn/Cu and Au/Sn/Cu ternary diffusion couples were used to investigate the solder volume effect on the cross-interact...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/61686353964640824775 |