The Relation Between Tin Whisker Growth and Stresses,Temperatures
碩士 === 國立中央大學 === 機械工程研究所碩士在職專班 === 95 === The purpose of this study is to investigate the tin whisker growth behavior on bright tin-plated copper under different applied stresses at room temperature (RT) and 50 ℃. Scanning electron microscopy (SEM) was employed to observe the tin whisker growth beh...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/43045037290305807530 |