Design and Implementation of Hybrid Substrate for High Power LEDs

碩士 === 國立彰化師範大學 === 電機工程學系 === 95 === The thesis utilizes the heat dissipation characteristic of aluminum board to cooperate with the low cost printed circuit board to propose hybrid substrate, which is suitable for high power LED packages. This is a high heat conductivity structure and also can be...

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Bibliographic Details
Main Authors: Chin-Sung Lin, 林進松
Other Authors: Jin-Jia Chen
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/42915756626121220562