| Summary: | 碩士 === 國立彰化師範大學 === 電機工程學系 === 95 === The thesis utilizes the heat dissipation characteristic of aluminum board to cooperate with the low cost printed circuit board to propose hybrid substrate, which is suitable for high power LED packages. This is a high heat conductivity structure and also can be used as a connector to supply LED with power. Thus, it can replace traditional aluminum base plate which can only use on welding line to supply LED with power. With the cooperation of aluminum board and the printed circuit board, the paths of the heat transfer and the electric power supply can be effectively separated and managed. This study shows that the thermal resistance is 1.23℃/W under LED power consumption of 2.196W when use hybrid substrate. In addition, with a choice of high reflectance aluminum board, light utilization can be effectively improved up to 30%.
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