Design and Implementation of Hybrid Substrate for High Power LEDs
碩士 === 國立彰化師範大學 === 電機工程學系 === 95 === The thesis utilizes the heat dissipation characteristic of aluminum board to cooperate with the low cost printed circuit board to propose hybrid substrate, which is suitable for high power LED packages. This is a high heat conductivity structure and also can be...
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ndltd-TW-095NCUE54420332015-10-13T16:51:33Z http://ndltd.ncl.edu.tw/handle/42915756626121220562 Design and Implementation of Hybrid Substrate for High Power LEDs 高功率LED複合式導熱基板之研製 Chin-Sung Lin 林進松 碩士 國立彰化師範大學 電機工程學系 95 The thesis utilizes the heat dissipation characteristic of aluminum board to cooperate with the low cost printed circuit board to propose hybrid substrate, which is suitable for high power LED packages. This is a high heat conductivity structure and also can be used as a connector to supply LED with power. Thus, it can replace traditional aluminum base plate which can only use on welding line to supply LED with power. With the cooperation of aluminum board and the printed circuit board, the paths of the heat transfer and the electric power supply can be effectively separated and managed. This study shows that the thermal resistance is 1.23℃/W under LED power consumption of 2.196W when use hybrid substrate. In addition, with a choice of high reflectance aluminum board, light utilization can be effectively improved up to 30%. Jin-Jia Chen Huey-Por Chanc 陳金嘉 張惠博 2007 學位論文 ; thesis 53 zh-TW |
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碩士 === 國立彰化師範大學 === 電機工程學系 === 95 === The thesis utilizes the heat dissipation characteristic of aluminum board to cooperate with the low cost printed circuit board to propose hybrid substrate, which is suitable for high power LED packages. This is a high heat conductivity structure and also can be used as a connector to supply LED with power. Thus, it can replace traditional aluminum base plate which can only use on welding line to supply LED with power. With the cooperation of aluminum board and the printed circuit board, the paths of the heat transfer and the electric power supply can be effectively separated and managed. This study shows that the thermal resistance is 1.23℃/W under LED power consumption of 2.196W when use hybrid substrate. In addition, with a choice of high reflectance aluminum board, light utilization can be effectively improved up to 30%.
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Jin-Jia Chen |
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Jin-Jia Chen Chin-Sung Lin 林進松 |
author |
Chin-Sung Lin 林進松 |
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Chin-Sung Lin 林進松 Design and Implementation of Hybrid Substrate for High Power LEDs |
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Chin-Sung Lin |
title |
Design and Implementation of Hybrid Substrate for High Power LEDs |
title_short |
Design and Implementation of Hybrid Substrate for High Power LEDs |
title_full |
Design and Implementation of Hybrid Substrate for High Power LEDs |
title_fullStr |
Design and Implementation of Hybrid Substrate for High Power LEDs |
title_full_unstemmed |
Design and Implementation of Hybrid Substrate for High Power LEDs |
title_sort |
design and implementation of hybrid substrate for high power leds |
publishDate |
2007 |
url |
http://ndltd.ncl.edu.tw/handle/42915756626121220562 |
work_keys_str_mv |
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