Miniaturization of CMOS Image Sensor Using Glass Cover Chip Package
碩士 === 國立彰化師範大學 === 電機工程學系 === 95 === Abstract The purpose of this thesis is to reduce the package size of CMOS image sensor by using glass cover chip（GCC）technique in the packaging manufacture process. Traditional packaging technique needs dam to attach optical glass on the chip. However, GCC techn...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/74654676608172353949 |