| Summary: | 碩士 === 國立彰化師範大學 === 電機工程學系 === 95 === Abstract
The purpose of this thesis is to reduce the package size of CMOS image sensor by using glass cover chip（GCC）technique in the packaging manufacture process. Traditional packaging technique needs dam to attach optical glass on the chip. However, GCC technique directly uses optical glass to attach chip using adhesive. Therefore the package size of GCC technique is smaller than that of the traditional package. Based on GCC technique and Taguchi method, in this thesis we design a new CMOS image sensor package structure. Experimental results demonstrate that the performance of the proposed design is better than that of the non-optimal design in term of adhesion force, package size and SNR (Signal to Nose Ratio). Further, simulations show that the thermal diffusion of our method is better than that of traditional method in the ratio of 245%. Hence, the proposed technique can meet the real requirements in the packaging process.
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