Hot roll design and process parameter study for dry film lamination
碩士 === 國立彰化師範大學 === 機電工程學系 === 95 === The purpose of this research is to improve the dry film lamination conformity regarding to layer height difference in Printed Circuit Board manufacturing. The lamination hot roller was redesigned to requirement in rigidity, heating uniformity, loss heat compensa...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/27236348664933350931 |