Multi-objective Process Optimization of Wire Bonding for Ball Grid Array
碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 95 === As technical developments progressed, semi-conductor packaging is now heading toward slender, high-density and high capillary count directions. At present, domestic package techniques are BGA, QFP, SOP, PLCC and PDIP based package techniques. Since BGA pack...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70553058653426566045 |