Process parameter optimization for Flip Chip process solder residue by in Taguchi method and response surface methodology
碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 95 === Optimization in the IC assembling manufacturing process has been the most common method applied by the engineers to increase product qualities. The efficient use of optimization to solve the problem leads to the respected results. In this study, Taguchi met...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36307558573147128183 |