The Investigation of Electromigration Influence on 99.3Sn-0.7Cu/96.5Sn-3Ag-0.5Cu Composite Flip-Chip Solder Bump at Different Current Density and Substrate Pad
碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 95 === The aim of this paper is to investigate the electromigration effect on lead-free solder joints under conditions of different temperature and current density. Samples were combined with 99.3Sn-0.7Cu/96.5Sn-3Ag-0.5Cu composite flip-chip solder bump and Ti/Ni(...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/38827271955452795266 |