Improvement of Flip Chip Underfill Systems
碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 95 === This research is mainly improved Flip chip Underfill systems, the discussion in order to reach the demand of condition of work in Packaging and test company''s factory, Underfill technological bottom glue is it make Cheng take place unusual state...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90891956182582345040 |