Electrodeposited copper thin films on ITO/Si substrate for copper metallization

碩士 === 國立屏東科技大學 === 材料工程所 === 95 === In this work, we use electrodepositing copper to take the place of sputtering copper in copper metallization. First, we use different thickness of ITO to be cathode sample, and electrodeposited copper film in different time. Last, we observe the heat stability of...

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Bibliographic Details
Main Authors: Jau-Bin,Chiou, 邱肇斌
Other Authors: Wen-Jauh,Chen
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/10526803229143233062