Process capability improvement and analysis for CUP device
碩士 === 國立中山大學 === 電機工程學系研究所 === 95 === Cost competitiveness is a major driving force in the semiconductor industry. The processing cost of an individual die is directly proportional to its size. Advances in processing technology have shrunk the device sizes in wire-bonded chips, resulting in a small...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/bur44d |