Passive Component Wire Bonding Evaluation in a Hybrid IC Package
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 95 === As the IC assembly technology fast developing in the modern electrical industries. Demand of high performance electric product is glowing up day by day. New generation of the hybrid IC assembly package has become the major role recently. In order to prevent...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/tuzk5n |