Reliability Study of IC Packages with Hygrothermal Effect
博士 === 國立中山大學 === 機械與機電工程學系研究所 === 95 === It is an important issue for manufacturing and operation to formulate reliability about the effects of the moisture absorption and IR reflow parameters on IC packages. Two problems, the warpage of the thin IC package, and characterizing the adhesion features...
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| Format: | Others |
| Language: | en_US |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13349487692402687101 |