The Study of Using X-Ray Laminography on PCB and BGA Inspection

碩士 === 國立清華大學 === 動力機械工程學系 === 95 === As to high-competitive electronic industry, the inspection of follow-up process not only enhances production yield but also reduces the waste of manufacture at failure. At present, traditional two-dimension automatic optical inspection machine is already useless...

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Bibliographic Details
Main Authors: Hung-Chi Chen, 陳宏吉
Other Authors: Shin-Chieh Lin
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/70864335639800939996