Quantification of Impact by Nanometer Dummy Metal Fills
碩士 === 國立清華大學 === 資訊工程學系 === 95 === In modern CMOS processes, eight or more interconnect layers are commonplace so that techniques to planarize the surface have become mandatory. Chemical-mechanical polishing (CMP) step is a technique to achieve planarization and dummy metal fills have been widely a...
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| Format: | Others |
| Language: | en_US |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/11757012024756661569 |