A Study on Batch Etching Process for Wafer Thinning
碩士 === 國立臺灣大學 === 機械工程學研究所 === 95 === Thin Wafer is becoming the main stream in the semi-conductor industry. The most widely used technology is grinding process; the advantage of the process is better TTV values and faster production. On the other hand, the disadvantage of the process is that grindi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42412319258563467712 |