Design and Development of a Wafer Level Package (WLP) Bonding System
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 95 === With the evolution of the semiconductor fabrication technology, there have been several basic shifts in electronic packaging over the last few decades. The surface-mount technology and ball-grid-array packages were two important steps for high-throughput ass...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/py4c86 |