Design and Development of a Wafer Level Package (WLP) Bonding System

• Main Authors: Jerry Fan, 范志文
• Other Authors: Fuh-Shyang Tuang
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/py4c86

碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 95 === With the evolution of the semiconductor fabrication technology, there have been several basic shifts in electronic packaging over the last few decades. The surface-mount technology and ball-grid-array packages were two important steps for high-throughput assembly of a wide variety of integrated circuits (ICs), while reducing the pad pitch on the printed circuit board. Recently, the wafer-level packaging (WLP) uses the technology of IC packaging at a wafer level, instead of the traditional assembly process of each individual unit after wafer dicing. The wafer bonding system is an extremely important production equipment for the WLP process. Up to now, most of the WLP bonder are manufactured from the US or Japan companies. There are very few domestic researches or design experiences about this topic. In this thesis, a systematic design and analysis of the WLP bonding system was made based on the customer specification. By integration of the vacuum, mechanics, pressure and temperature control techniques, an 8-inch WLP bonding system was fabricated. In particular, the conventional molding mechanics is modified and can be operated in the vacuum system. The pressure uniformity can control within �b4.6% and the temperature uniformity can reach �b2.7%. The yield performance has matched the specification of the mass production equipment.