Design and Development of a Wafer Level Package (WLP) Bonding System
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 95 === With the evolution of the semiconductor fabrication technology, there have been several basic shifts in electronic packaging over the last few decades. The surface-mount technology and ball-grid-array packages were two important steps for high-throughput ass...
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ndltd-TW-095NYPI51240072019-09-22T03:40:57Z http://ndltd.ncl.edu.tw/handle/py4c86 Design and Development of a Wafer Level Package (WLP) Bonding System 晶圓級封裝壓合系統之研究開發 Jerry Fan 范志文 碩士 國立虎尾科技大學 光電與材料科技研究所 95 With the evolution of the semiconductor fabrication technology, there have been several basic shifts in electronic packaging over the last few decades. The surface-mount technology and ball-grid-array packages were two important steps for high-throughput assembly of a wide variety of integrated circuits (ICs), while reducing the pad pitch on the printed circuit board. Recently, the wafer-level packaging (WLP) uses the technology of IC packaging at a wafer level, instead of the traditional assembly process of each individual unit after wafer dicing. The wafer bonding system is an extremely important production equipment for the WLP process. Up to now, most of the WLP bonder are manufactured from the US or Japan companies. There are very few domestic researches or design experiences about this topic. In this thesis, a systematic design and analysis of the WLP bonding system was made based on the customer specification. By integration of the vacuum, mechanics, pressure and temperature control techniques, an 8-inch WLP bonding system was fabricated. In particular, the conventional molding mechanics is modified and can be operated in the vacuum system. The pressure uniformity can control within �b4.6% and the temperature uniformity can reach �b2.7%. The yield performance has matched the specification of the mass production equipment. Fuh-Shyang Tuang Dong-Xing Wu 莊賦祥 武東星 2007 學位論文 ; thesis 71 zh-TW |
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碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 95 === With the evolution of the semiconductor fabrication technology, there have been several basic shifts in electronic packaging over the last few decades. The surface-mount technology and ball-grid-array packages were two important steps for high-throughput assembly of a wide variety of integrated circuits (ICs), while reducing the pad pitch on the printed circuit board. Recently, the wafer-level packaging (WLP) uses the technology of IC packaging at a wafer level, instead of the traditional assembly process of each individual unit after wafer dicing.
The wafer bonding system is an extremely important production equipment for the WLP process. Up to now, most of the WLP bonder are manufactured from the US or Japan companies. There are very few domestic researches or design experiences about this topic. In this thesis, a systematic design and analysis of the WLP bonding system was made based on the customer specification. By integration of the vacuum, mechanics, pressure and temperature control techniques, an 8-inch WLP bonding system was fabricated. In particular, the conventional molding mechanics is modified and can be operated in the vacuum system. The pressure uniformity can control within �b4.6% and the temperature uniformity can reach �b2.7%. The yield performance has matched the specification of the mass production equipment.
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author2 |
Fuh-Shyang Tuang |
author_facet |
Fuh-Shyang Tuang Jerry Fan 范志文 |
author |
Jerry Fan 范志文 |
spellingShingle |
Jerry Fan 范志文 Design and Development of a Wafer Level Package (WLP) Bonding System |
author_sort |
Jerry Fan |
title |
Design and Development of a Wafer Level Package (WLP) Bonding System |
title_short |
Design and Development of a Wafer Level Package (WLP) Bonding System |
title_full |
Design and Development of a Wafer Level Package (WLP) Bonding System |
title_fullStr |
Design and Development of a Wafer Level Package (WLP) Bonding System |
title_full_unstemmed |
Design and Development of a Wafer Level Package (WLP) Bonding System |
title_sort |
design and development of a wafer level package (wlp) bonding system |
publishDate |
2007 |
url |
http://ndltd.ncl.edu.tw/handle/py4c86 |
work_keys_str_mv |
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