Thickness and refractive index measurements using Mirau interferometric microscope
碩士 === 國立臺北科技大學 === 光電工程系所 === 95 === With the improvement of fabrication in the semiconductor and MEMS (Micro-Electro-Mechanical Systems) field and the miniaturization of the device size, the requirement for the processing quality is stricter. Accordingly, it is necessary to conduct non-destructive...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/2bm7ng |