A Study of Optimal parameters for the Multi-response IC Wire Bonding Process
碩士 === 國立雲林科技大學 === 工業工程與管理研究所碩士班 === 95 === For recent years, electronic products are becoming lighter, slimmer, shorter and smaller in size, and the problems about product and process are more and more complexity. Therefore, the process of experiment design of nowadays has to consider the optimiz...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/26331066139504059210 |