Automatic Wafer Defects Analysis Using Image Processing Techniques and Neural Networks
碩士 === 元智大學 === 資訊管理學系 === 95 === Analysis of semiconductor wafer is increasingly in need of applying imaging determination, yet present process still relies partly to human visual determination for categorization. It takes time and the results are closely related to the categorization and determina...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/67941771488958117065 |