The Fatigue Life Estimation and Solder Balls Optimum Design for the PBGA Components under Vibration Loading

博士 === 元智大學 === 機械工程學系 === 95 === In this study, the reliability of the PBGA components under vibration loading when at resonance is investigated by integrating practices of vibration fatigue life test, finite element analysis and theoretical estimation. In the fatigue life test, the printed circuit...

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Bibliographic Details
Main Authors: Ching-Shun Wang, 王慶順
Other Authors: 陳永樹
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/21005345697065392072