Investigation of Thermally-Induced Warpage of Package on Package
碩士 === 長庚大學 === 機械工程研究所 === 96 === Package on Package (POP) is popularly accepted in the electronic packaging research, due to the its special features such as separated functional test on top and bottom packages, low cost, and high yield. Because of its multilayer structure, the warpage of packages...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Published: |
2008
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/22753144682736838225 |