Non-destructive Extraction of Inter-Connect Width and Thickness for Nanometer Technology
碩士 === 中原大學 === 資訊工程研究所 === 96 === Semiconductor generation have made great strides from deep sub-micro towards nano-technologies by making great progress in VLSI (Very Large Scale Integration) and advanced processes. It results in reducing interconnect size, adding stack of metal layers, adapting C...
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| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/33611873869040977576 |