Wafer Level Chip Sized Package LED
碩士 === 大葉大學 === 電機工程學系碩士在職專班 === 96 === This treatise offer a simple, fast, reliable, cost-decreasing and less heat-reserving package method of LED – Wafer Level Chip Sized Package [WLCSP LED]. In this method, we made an anti-environment protection layor on LED wafer directly in wafer chip process...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/57788441211425337330 |