Applying Stacked Multi-Channel Cold-Plate to Thermal Package of Miscellaneous Microprocessors
碩士 === 逢甲大學 === 自動控制工程所 === 96 === With the trend of rapid increases in semiconductor densities and miniaturization prevailing in the high-power electronics, effective thermal management solutions have become necessary. Due to heat removal capability of pure air cooling is not effectively sufficient...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52250008067204141469 |