Mechanical Analysis and Design of Next-Generation Advanced Ultra-fine-Pitched Flip Chip Technology
碩士 === 逢甲大學 === 航太與系統工程所 === 96 === Nowadays, electronic devices are being pushed toward miniaturization by the integrated circuits (IC) industry in order to enhance the speed and functionality of IC. Consequently, interconnect is becoming a critical issue. ITRS in 2003 predicted that the I/O pitch...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01856594294437725160 |