Laser scribing and cutting techniques for brittle substrates
碩士 === 華梵大學 === 機電工程學系博碩專班 === 96 === The aim of this paper is to study the laser scribing and cutting techniques for LCD glass and alumina substrates. A point diamond was used to generate a groove-crack along the cutting path in a substrate surface. The glass substrate was then separated by applyin...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/86879079494566949202 |