Laser scribing and cutting techniques for brittle substrates

• Main Authors: Tzu-Shian Weng, 翁祖賢
• Other Authors: Chwan-Huei Tsai
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/86879079494566949202

碩士 === 華梵大學 === 機電工程學系博碩專班 === 96 === The aim of this paper is to study the laser scribing and cutting techniques for LCD glass and alumina substrates. A point diamond was used to generate a groove-crack along the cutting path in a substrate surface. The glass substrate was then separated by applying a defocused CO2 laser beam along the grooved line to drive the crack extending through the thickness of the substrate. If the laser scanning speed is higher, the crack extending will not penetrate the thickness of the substrate and a blinded-crack will be formed. If the laser scanning speed is slower, the crack will extend throughout the thickness of the substrate. The diamond-grooving can enhance the scribing speed that can be attained. The relationships between the diamond force, groove depth, laser power, scribing depth, and scribing speed that can be attained were obtained from experimental analyses. The SEM photographs of the scribing surface and breaking surface were obtained to analyze the mechanism during the laser scribing and cutting process. The acoustic emission signals generated during the fracture process were analyzed to obtain crack propagating process. Finally, the finite element software ANSYS was employed to calculate the temperature and stress distributions to explain the mechanism of the fracture extension.