Study of parameter on the Bonding Strength for Inner Lead Bonding
碩士 === 義守大學 === 電子工程學系碩士班 === 96 === Owing to wide ripe field of LCD, dimension reductions become the main target for next stage. The manufacturing capability of driver IC were strongly exalt caused by two factors : fine pitch chip layout improvement, and manufacturing capability for FPC COF is the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/09398151198258485119 |