Improve Heat Dissipation Via Enhance Air-Solid Heat Exchange
碩士 === 義守大學 === 電子工程學系碩士班 === 96 === This study definitively identified that the small air-solid heat exchange coefficient is the major blocking factor to achieve effective heat dissipation from solid surface below 65℃ demanded by most of semiconductor devices. It is found that a ceramic coating on...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46850990400624153356 |