The Study of Machining Microstructure of the Silicon Wafer by Picosecond Laser
碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 96 === The study is to examine how picosecond laser affects the microstructure of the thin silicon wafer. Traditionally diamond cutters are chosen to cut grooves on the silicon wafers. The method, if applied carelessly, would cause cracks at the cutting edges. In ad...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32549047808591981107 |