A Study of Transient／Steady-State Wear of Dicing Blade and Wafer Chipping
碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 96 === The purpose of this study is to investigate the dicing blade wear and dice chipping on transient／steady-state wear region. According to transient wear regime which wear volume and coefficient were higher than steady-state wear region. The dicing blade of w...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/86351880421541300255 |