| Summary: | 碩士 === 明新科技大學 === 電子工程研究所 === 96 === Nowadays, the device under test (DUT) is still tested by manual in Taiwan’s high technology companies. The quality of DUT is not increased with human resource and cost. So, in this study, a system to detect and analyze the devices soldered on the printed circuit board using image detector is proposed. The system includes a camera system, a sample detector system and a PCI transmission interface system. We also proposed a technique to judge the thickness of solder. Two white lights in two different angles are used to shine on the soldered joints. One of the angles is closed to 90 degree, and the other is closed to 0 degree. The CCD system takes the image at the top of printed circuit boards. The program written in LabVIEW computes the device’s positions before to detect the quality of the soldered joints. The new method decreases the light sources from three to two and replaces the color light source by white light source. Therefore, both the computing amount and the cost are decreased because only gray level images are used. This technique can analyze the soldered joints to know the solder is too few or too much in advance. The whole system can detect the problems about the soldered joints, and can feedback the result to increase the quality of process.
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