Electromigration study of Sn-9 wt%Zn solder
碩士 === 國立中興大學 === 化學工程學系所 === 96 === Removing Pb from the electronics has became a global trend and the traditional SnPb solder will soon be replaced. The Sn-9Zn (in wt.%) solder alloy is one of the potential candidates because it has a melting point (198.5℃) that is closer to that of the convention...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/12183296653585378230 |