Microstructures and Mechanical Reliability of Sn-Ag-Cu Lead-Free Solder
碩士 === 國立中興大學 === 材料科學與工程學系 === 96 === Tin-silver-copper lead-free solder balls were welded on substrate pads by reflow soldering in this research. Different reflow temperatures were applied to study the effect of reflow temperature on the morphology, microstructure and mechanical reliability of sol...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/60673406298149481821 |