Design and Fabrication of Light Emitting Diode Packaging with High Thermal Dissipation
碩士 === 國立中興大學 === 材料科學與工程學系 === 96 === Using maskless self-alignment lithography and metal electroplating techniques, we have demonstrated an enhanced performance of lateral-electrodes GaN light emitting diode (LED) with a reflective copper (Cu) heating spreading layer. The ANSYS and TracePro softwa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/57725031657840518936 |