Prediction Fatigue Initiation Life of 63Sn/37Pb Solder Joint Specimens under Cyclic Proportional Displacement Path Via The Endochronic Viscoplasticity with Cyclic Damage

碩士 === 國立成功大學 === 工程科學系碩博士班 === 96 === In 2007, for the solder joint Sn/3.5Ag/0.75Cu cyclic proportional displacement path, Lee and Lee proposed the modification of solder joint specimen with stiffness of material testing system, and figured out the grip stiffiness by using series connetion concept....

Full description

Bibliographic Details
Main Authors: Jun-Wei Chang, 張峻偉
Other Authors: C. F. Lee
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/69684114299140282725