Solder Joint Reliability and Fracture Mechanism under High Shear Test
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 96 === The shear strength of four solder joints (Sn37Pb, Sn8.5Zn0.5Ag0.01Al0.1Ga, Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu) on two kinds of substrates (Ni/Au and OSP Cu) were investigated using high speed shear test. These investigations were tried to correlate with the...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/34851969845810915683 |