Study of EFO Characteristics and Factors Affecting Thermosonic Bond Reliability for Fine Copper Wire
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 96 === Traditionally, gold is the preferred material to connect IC chips to lead frames or the bond pads by a thermosonic process. The inherent properties, such as higher electrical and thermal conductivity, of copper as well as its cost effectiveness, when compar...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87382011286798899495 |