Measurement of Coplanarity and Warpage of Electronic Components Using Shadow Moire Method
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 96 === In this paper, the major purpose is to develop a method to determine the coplanarity quickly and to measure the coplanarity and warpage of electronic components using shadow moiré method. The time of calculating the coplanarity can be decreased effectively. In...
Main Authors: | Ching-Chao Chen, 陳璟照 |
---|---|
Other Authors: | Terry Yuan-Fang Chen |
Format: | Others |
Language: | zh-TW |
Published: |
2008
|
Online Access: | http://ndltd.ncl.edu.tw/handle/65515152280977541978 |
Similar Items
-
Digital Shadow Moir''e method for warpage measurement
by: Yen-Tung I, et al.
Published: (2000) -
Measurement of Warpage of Electronic Components and System Calibration under Heating Condition Using Shadow Moire Method
by: YU-SYUNLIOU, et al.
Published: (2016) -
Investigation of Warpage of Electronic Packagings After Machining by Phase-Shifting Shadow Moire Method
by: LIU, YU-WEN, et al.
Published: (2001) -
Development of wafer warpage measurement technique using Moire method
by: Yu-hsuan Tsai, et al.
Published: (2014) -
Development of a warpage measurement technique by using stroboscopic moiré method
by: Yao-Chung Chang, et al.
Published: (2015)